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Height measurement of a wire bond

Semiconductor manufacturing

Defects in bonding wires can cause a ciruit board to malfunction.

Benefit

The 2 μm beam spot and double scanning method ensures stable measurements.

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  • LT-9000 series - Surface Scanning Laser Confocal Displacement Meter

    Surface scanning laser displacement meter. Z-axis scanning for accuracy and resolution. X-axis scanning for stability. Transparents targets are not a problem.

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