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Marking on IC package

Marking on IC package

Marking on IC packages

Crating high contrasting marks on IC packages becomes more difficult as the thickness of IC packages becomes thinner and thinner. High contrast marks without engraving is necessary to eliminate damage and the MDV series laser provides a clear advantage.


High contrast marking without engraving. And a 300mm wide area helps reducing the need for product indexing and X-Y stages.


  • MD-F3100/5100 series - 3-Axis Fibre Laser Marker

    A combination of best-in-class 50 W output and 3-Axis control. Once again, KEYENCE leads the way in cutting edge laser marking technology.

  • MD-V9900A series - 3-Axis YVO4 Laser Marker

    For the first time in the industry, a laser marker has the capability to perform marking not only in the X and Y directions, but also the Z direction! The MD-V employs YVO4 as its laser crystalline media for stable high-aquality marking.

  • MD-F3000 series - 3-Axis Fibre Laser Marker

    The world's smallest laser marker with a fanless architecture is possible due to original technology developed by KEYENCE. The MD-F Series is a dramatic advancement in the evolution of direct part marking.

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