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          Ultra-High-speed, High-accuracy Optical Micrometer

          LS-9000 series

          Enhanced speed and accuracy

          3-CMOS System

          Even vibrating targets are measured stably

          Measuring the outer diameter of a high-speed wire

          High-speed exposure is used so that a precise inspection of the target can be performed even if the target is vibrating, making accurate measurement possible.

          High-speed CMOS

          Error in relation to vibrating workpieces

          16,000 Hz sampling

          By integrating the peripheral circuits of the measurement CMOS into one chip, the S/N ratio has been dramatically improved and high-speed sampling achieved. For example, targets that move at 1,000 m/min. can be measured at a pitch of around 1 mm. Even parts that vibrate at high speeds can be measured stably.

          Even misaligned parts are measured stably

          Measuring the outer diameter of a shaft

          The target monitor CMOS recognises the orientation of the part and adjusts the measured value so there are no measurement errors due to inclination.

          Monitor CMOS

          Monitor image

          Alignment adjustment

          Recognises the misalignment of a workpiece from the image taken by the monitor CMOS. Inclination error is removed automatically and does not affect the measurement result. The captured image can also be checked with computer software so even novices will have no problem taking measurements.

          Two axis target position indicator

          Measuring the position and outer diameter of an optic fibre

          The LS-9000 can use the target positioning CMOS receiver to determine the location of the measurement target in two axes. This makes installation and part position feedback simple, even with a single axis system.

          Target positioning CMOS

          Position recognised in a 2D area

          Transmitter/receiver direction and position measurement

          With the additional data obtained from the target positioning CMOS, the LS-9000 can determine the position of the target in both the X and Y axes.

          Ultra-thin outer diameter and ultra-thin gap measurement

          Measuring the outer diameter of an ultra-thin wire

          Specialized ultra-fine diameter / gap tool now allows measurement of gaps and diameters previously undetectable.

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