NEW Ultra High Speed Sensing Ioniser Hybrid Type SJ-E Series Supersonic Air Speed Revolutionises
Static Elimination

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World's fastest static elimination

2× faster than conventional models

By using a supersonic structure, the air velocity of flow exceeds the sound of speed, dramatically improving the speed at which the ions reach the target. In addition, the shape of the electrode probe that applies fluid mechanics allows the surrounding air to enter, thereby increasing the air flow.
By combining these two technologies, it is possible to achieve the world's fastest elimination of static electricity.

Electrode probe with supersonic structure
Static elimination speed comparison graph
Measurement conditions:
  • Static elimination time from ±1000 V to ±100 V
  • Using 150 mm × 150 mm plate monitor (20 pF)
  • Air supply of 50 L/min (1080 mm bar length)
  • No downflow

Low maintenance

5× less than conventional models

Air at supersonic speed forms a shock wave on the tip of the electrode probe.
The shock wave breaks the space, minimizing the inflow of external air.
Compared to the conventional enclosure rating, a significant air wall is formed, enabling dramatically lower maintenance even with a small flow rate.

Air division part

Because the generated air and the surrounding air are divided, foreign contaminants in the surrounding area cannot get close to the tips of the electron probes.

Change in static elimination time over time (example)
Measurement conditions:
  • Static elimination time from ±1000 V to ±100 V
  • Using 150 mm × 150 mm plate monitor (20 pF)

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Applications

Static elimination when transferring PCBs
Target
Liquid crystal glass
Goal
Counter measures against foreign contamination
Static elimination when transferring front panels
Target
Front panels
Goal
Counter measures against foreign contamination
Static elimination prior to vehicle frame painting
Target
Vehicle frames
Goal
Counter measures against foreign contamination
Static elimination of entyre moulds
Target
Mould
Goal
Counter measures against products adhering to moulds
Static elimination during wafer inspection
Target
Wafers
Goal
Counter measures against damage caused by electrostatic discharges and against foreign contamination
Static elimination when transferring instant noodles
Target
Cups and ingredients
Goal
Counter measures against cup sealing defects and against ingredients sticking to cups

Plus d'informations dans le catalogue

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