Advancements in technology have led to smaller, thinner devices like smartphones, tablets, and wearables. As a result, printed circuit boards (PCBs) and components have also become denser and more complex.
Consequently, it has become more difficult to observe fine parts (such as through holes, lands, and pads) and measure 3D shapes (surface irregularities) for the research and development and quality assurance of printed circuit boards (PCBs) and printed wired boards (PWBs)